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"Bring Your Own Capacity" - Google And Voltus To Deploy Virtual Power Plant
"Bring Your Own Capacity" - Google And Voltus To Deploy Virtual Power Plant
Google signed a three-year Bring Your Own Capacity (BYOC) agreement with Voltus for up to 100 MW of accredited distributed capacity in the PJM Interconnection. Voltus will aggregate batteries, smart thermostats, electric vehicles, and other flexible assets from homes and businesses into a Google-funded Virtual Power Plant (VPP).
When the grid needs relief, the software dispatches those resources in concert. Participants get paid, and Google gets capacity without waiting for traditional interconnection queues.
A VPP is not a physical...
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Apr 6, 2026 / Tyler Durden
Trump Threatens To 'Take Out Entire Country Of Iran' Tomorrow Night, Demands 'Free Traffic Of Oil' In Hormuz
Trump Threatens To 'Take Out Entire Country Of Iran' Tomorrow Night, Demands 'Free Traffic Of Oil' In Hormuz
Summary:
Trump threatens "Iran can be taken out in one night... maybe tomorrow"; Warns 'every bridge and power plant' will be destroyed
WSJ reports US military is making preparations for potential strikes on energy targets in Iran
A Sunday night Axios report on a US-proposed 45-day ceasefire has by Monday morning been rejected by Iran, which later on Monday issued a 10-point letter via Pakistan.
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Mar 5, 2026 / Judge Andrew P. Napolitano
Napolitano: Trump’s Unjust and Unconstitutional War
What’s going on here? What’s going on is an immoral, unconstitutional and illegal war of choice.
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Jun 29, 2026 / Tyler Durden
World's Largest Chipmaker, Taiwan Semi, Accelerates Local DRAM Supply Chain With Winbond Collaboration
World's Largest Chipmaker, Taiwan Semi, Accelerates Local DRAM Supply Chain With Winbond Collaboration
In a time of heightened scrutiny on the memory supply chain, overnight the world's largest chipmaker, Taiwan's TSMC, is reportedly building out a domestic DRAM supply chain in Taiwan amid a severe global memory shortage, bringing in Winbond as a partner, UDN reported.
TSMC and Winbond are collaborating on a localized DRAM supply chain using 3D wafer-on-wafer (WoW) stacking technology, where Winbond would supply DRAM memory wafers to be stacked with TSMC's logic wafers. The move is designed...
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