Monolithic 3D Silicon Chips Achieve Near-Perfect Yields At Low Temperatures

Monolithic 3D Silicon Chips Achieve Near-Perfect Yields At Low Temperatures Authored by Neetika Walter via Interesting Engineering, Researchers at the University of Illinois Urbana-Champaign have developed a way to stack high-performance silicon circuits directly on top of one another, a breakthrough that could help the semiconductor industry keep increasing computing power without shrinking transistors further. The 200-mm wafer contains multiple silicon layers stacked for monolithic 3D chip integration.University of Illinois Urbana-Champaign The approach tackles one of the biggest challenges facing chipmakers as Moore's law begins to slow. For decades, the industry boosted performance...