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Israeli Attacks in Gaza Kill Six Palestinians in 24 Hours
Gaza’s Health Ministry said on Monday that Israeli attacks over the previous 24-hour period killed at least six Palestinians and wounded 40 as the IDF continues its constant violations of the US-backed ceasefire deal. “A number of victims are still under the rubble and in the streets, as ambulance and civil defense crews have been […]
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Apr 26, 2026 / Tyler Durden
The Technate Was Always Coming
The Technate Was Always Coming
Authored by Mark Jeftovic via BombThrower.com,
And what you can do about it (besides complaining).
Palantir dropped a manifesto last weekend. 22 bullet points distilled from Alex Karp’s book The Technological Republic, posted to X with the casual framing of “because we get asked a lot.” I haven’t seen a reaction so widespread, unanimously opposed and viscerally aghast since James Damore’s infamous “Google’s Ideological Echo Chamber”.
The usual suspects lost their shit. Engadget called it “the ramblings of a comic book villain.”
TechCrunch clutched its pearls at the bits about “regressive” cultures...
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Apr 19, 2026 / Tyler Durden
U.S. Navy Deploys Sea Robots To Sweep Hormuz Chokepoint For Mines
U.S. Navy Deploys Sea Robots To Sweep Hormuz Chokepoint For Mines
The US military is deploying unmanned and autonomous surface platforms that can tow an advanced mine-hunting sonar system to detect sea mines that were deployed by Iranian naval forces. This development comes even as Iran closed the Hormuz chokepoint on Saturday morning.
By Sunday morning, Iran's chief negotiator said some progress had been made in negotiations with the US, but there is still a long way to go before a deal is reached.
Despite the volatility in the Hormuz chokepoint's operational status, somewhat...
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May 31, 2026 / Tyler Durden
Monolithic 3D Silicon Chips Achieve Near-Perfect Yields At Low Temperatures
Monolithic 3D Silicon Chips Achieve Near-Perfect Yields At Low Temperatures
Authored by Neetika Walter via Interesting Engineering,
Researchers at the University of Illinois Urbana-Champaign have developed a way to stack high-performance silicon circuits directly on top of one another, a breakthrough that could help the semiconductor industry keep increasing computing power without shrinking transistors further.
The 200-mm wafer contains multiple silicon layers stacked for monolithic 3D chip integration.University of Illinois Urbana-Champaign
The approach tackles one of the biggest challenges facing chipmakers as Moore's law begins to slow. For decades, the industry boosted performance...
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